When it comes to soldering of electrical components on to printed circuit board (PCB), surface mount technology (SMT) is the most widely used method. The SMT reflow soldering oven is the machine that has greatly contributed to this technology. Highly technical principles in bonding are all put together to ensure optimal functionality of this particular machine that has literally transformed the electronics industry. In addition to precise control of this process, the machine consumes less power than other methods used and produces more products per unit time than any other method.
This is one of the machines that get used more often than any other machines in the electrical line of assembly. Before passing over to the oven, the solder paste made of flux, small solder particles and chemical cleaning agents is used to loosely attach the electrical components on to the printed circuit board (PCB) and then sent to the next step.
It involves joining of electrical components on to contact pads with solder paste and heat. In the process of highly controlled heating that take place in the oven, solder melts in the right position and permanently join the electrical components on PCB in the process.
SMT soldering ovens are designed with specific zones, stages which numbers to a total of four. It all starts from the preheat zone. In this stage, the melting temperature of the solvent in paste is set. The time/temperature relationship also known as ramp is determined to help control heating in other zones.
At thermal soak zone, the components are exposed to heat for about 60-120 seconds. The heat produced at this stage should be enough to remove all the volatiles of solder paste. The reflow zone then takes over. At this stage, the components get exposed to the maximum possible temperature which is normally set a few degrees below the maximum temperature tolerable by the component with the lowest tolerable temperature. This reduces surface tension at joints, the result of which is the bonding between pads and the electronic components.
The cooling zone is the last phase where controlled cooling is done to avoid thermal shock. This result of this is permanent bonding of the electrical components to PCB ready for use in electronic market after cleaning and testing.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
The revolution in technology has seen production of better SMT reflow soldering ovens with the latest ones being very efficient in energy consumption, capable of large volume of production thus reducing assembly and handling time and with better quality finished products which all translates to higher profits for the firm and better and safer electronics.
This is one of the machines that get used more often than any other machines in the electrical line of assembly. Before passing over to the oven, the solder paste made of flux, small solder particles and chemical cleaning agents is used to loosely attach the electrical components on to the printed circuit board (PCB) and then sent to the next step.
It involves joining of electrical components on to contact pads with solder paste and heat. In the process of highly controlled heating that take place in the oven, solder melts in the right position and permanently join the electrical components on PCB in the process.
SMT soldering ovens are designed with specific zones, stages which numbers to a total of four. It all starts from the preheat zone. In this stage, the melting temperature of the solvent in paste is set. The time/temperature relationship also known as ramp is determined to help control heating in other zones.
At thermal soak zone, the components are exposed to heat for about 60-120 seconds. The heat produced at this stage should be enough to remove all the volatiles of solder paste. The reflow zone then takes over. At this stage, the components get exposed to the maximum possible temperature which is normally set a few degrees below the maximum temperature tolerable by the component with the lowest tolerable temperature. This reduces surface tension at joints, the result of which is the bonding between pads and the electronic components.
The cooling zone is the last phase where controlled cooling is done to avoid thermal shock. This result of this is permanent bonding of the electrical components to PCB ready for use in electronic market after cleaning and testing.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
The revolution in technology has seen production of better SMT reflow soldering ovens with the latest ones being very efficient in energy consumption, capable of large volume of production thus reducing assembly and handling time and with better quality finished products which all translates to higher profits for the firm and better and safer electronics.
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